Solder Paste Evaluation Checklist Form
Use this checklist to assess solder paste quality and process suitability in electronics manufacturing. Please review each criterion carefully.
Packaging Integrity
*
No damage or leaks
Label and batch info clearly visible
Expiration Date Valid
*
Yes
No
Paste Viscosity
*
1
2
3
4
5
Printability (stencil release, definition)
*
1
2
3
4
5
Solder Balling After Reflow
*
None observed
Minor
Major
Slump (cold and hot)
*
No slump
Slight slump
Significant slump
Tackiness / Tack Retention
*
1
2
3
4
5
Residue Appearance and Cleanability
*
Clear, easy to clean
Slight residue, removable
Heavy or sticky residue
Reflow Profile Compatibility
*
Compatible with process
Requires adjustment
Not compatible
Overall Assessment / Additional Notes
Submit Evaluation
Should be Empty: